Thermal Grease Paste Compound Silicone CPU PC HeatSink 38g

item#: Stars-200

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Description:

Thermal Grease Paste Compound Silicone CPU PC HeatSink 30g

Heatsink componunds
*Specification*
Features		unit	Environment	Test	Result
é¢œè‰²	Color	No	No	Visual	White
çƒä¼ å¯¼ç³»æ•°	Thermal Conductivity	W/(m·K)	25â„ƒ	ROCT8.140-82	ï¼ž 0.95
çƒé˜»æŠ—	Thermal Impedance	â„ƒ-m²/W	25â„ƒ	ASTM D5470	ï¼œ 0.219
æ¯”é‡	Specific Gravity	No	25â„ƒ	ASTM D1475	ï¼ž 2
è’¸å‘é‡	Evaporation	%	200â„ƒ/24Hours	Fed.Std.791	ï¼œ 0.001
æ¸—æ²¹é‡	Bleed	%	200â„ƒ/24Hours	Fed.Std.791	ï¼œ 0.05
ç»ç¼˜å¸¸æ•°	Dielectric Constant A	No	100Hz	ASTM D150	ï¼ž 5.1
è€—æ•£ç³»æ•°	Dissipation Factor A	No	100Hz	ASTM D150	ï¼œ 0.005
ç²˜åº¦å€¼	Viscosity	CPS	25â„ƒ	GB/T-10247	59
é”¥å…¥åº¦	Thixotropic Index	mm	25â„ƒ	GB/T-269	380±10
å·¥ä½œæ¸©åº¦èŒƒå›´	Operation Temperature	â„ƒ	No	No	-50~180 â„ƒ

*Elements*
çŸ½åŒ–åˆç‰©	Silicone Compounds				50%
ç¢³åŒ–åˆç‰©	Carbon Compounds				20%
æ°§åŒ–é‡‘å±¬åŒ–åˆç‰©	Metal Oxide Compounds				30%

*Package*			ST	SP	TU	CN
Series	contant	Out pack	Tube	Mini	Needle Tubing	Bottle
ST200	white	Orange	No	0.5g 1g 1.5g	0.5g 1g 1.5g	30g, 150g , 1kg

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