Thermal Grease Paste Compound Silicone CPU PC HeatSink 30g

Heatsink componunds
Specification
Features		unit	Environment	Test	Result
颜色	Color	No	No	Visual	White
热传导系数	Thermal Conductivity	W/(m·K)	25℃	ROCT8.140-82	＞ 0.95
热阻抗	Thermal Impedance	℃-m2/W	25℃	ASTM D5470	＜ 0.219
比重	Specific Gravity	No	25℃	ASTM D1475	＞ 2
蒸发量	Evaporation	%	200℃/24Hours	Fed.Std.791	＜ 0.001
渗油量	Bleed	%	200℃/24Hours	Fed.Std.791	＜ 0.05
绝缘常数	Dielectric Constant A	No	100Hz	ASTM D150	＞ 5.1
耗散系数	Dissipation Factor A	No	100Hz	ASTM D150	＜ 0.005
粘度值	Viscosity	CPS	25℃	GB/T-10247	59
锥入度	Thixotropic Index	mm	25℃	GB/T-269	380±10
工作温度范围	Operation Temperature	℃	No	No	-50~180 ℃
Elements
矽化合物	Silicone Compounds				50%
碳化合物	Carbon Compounds				20%
氧化金屬化合物	Metal Oxide Compounds				30%

Package			ST	SP	TU	CN
Series	contant	Out pack	Tube	Mini	Needle Tubing	Bottle
ST200	white	Orange	No	0.5g 1g 1.5g	0.5g 1g 1.5g	30g, 150g , 1kg