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Features:
High stability and reliability, durable. It is used for mounting chip heat sinks on integrated circuits, and the cooling body has good heat dissipation effect.
Applicable to PC components such as CPU, Graphics Card.
Help effectively dissipate heat from the central processor to the heat sink.
Low thermal resistance, high thermal conductivity and excellent heat transfer performance.
High temperature resistance. Non-toxic, odorless, non-corrosive.
Specification:
Thermal conductivity: >0.671 W/m-k
Thermal resistance: <0.06°C-in2/W
Weight: Approx. 5 g/pc
Package list:
1pc Silicone Grease
How To Use:
When using, directly extrude the product, rub it with the surface of the adherend, and cover it immediately after use, in case of trial again.
The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.
Recommended thickness: 0.1-0.5mm, the thinner the better.
Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean.